Systems and methods for monitoring seed placement within the ground

ABSTRACT

A system for monitoring seed placement within the ground during the performance of a planting operation with a planting implement includes a row unit of that has a furrow opening assembly configured to create a furrow in the soil and a furrow closing assembly configured to close the furrow after the seeds have been deposited therein. Each seed is treated with a treatment applied after the seed is received within a component of the planting implement and before the furrow is closed around the seed, the treatment having a treatment dielectric property that is greater than a dielectric property of the seeds without the treatment. Additionally, the system includes a computing system configured to determine a seed placement parameter associated with the seeds as treated and planted underneath the surface of the soil based on data generated by a seed placement sensor supported relative to the row unit.

FIELD OF THE INVENTION

The present disclosure relates generally to planting operationsperformed using a planting implement, such as a planter or a seeder,and, more particularly, to systems and methods for monitoring seedplacement within the ground during the performance of a plantingoperation.

BACKGROUND OF THE INVENTION

Planting implements, such as planters, are generally known forperforming planting operations within a field. A typical planterincludes a plurality of row units, with each row unit including variousground engaging tools for creating a furrow within the soil, placing aseed within the furrow, and closing the soil around the seed. Typically,to monitor the operation of a given row unit, a sensor will often beprovided with unit's seed tube for detecting seeds as they pass throughthe tube before being deposited within the furrow. Such sensor data isthen used to estimate certain seed-related parameters, such as theseeding rate. However, since the seed tube sensor is detecting the seedsprior to their deposition within the soil, the associated sensor datacannot be used to accurately estimate parameters related to theplacement of seeds within the soil, such as the seed depth or spacingbetween seeds, particularly since the seeds may bounce, roll, orotherwise land off-target as they are dropped from the seed tube intothe furrow. Seeds may also be displaced during the furrow closingprocess, which cannot be detected using the seed tube sensor.

Accordingly, an improved system and method for monitoring seed placementwithin the ground during the performance of a planting operation wouldbe welcomed in the technology.

BRIEF DESCRIPTION OF THE INVENTION

Aspects and advantages of the invention will be set forth in part in thefollowing description, or may be obvious from the description, or may belearned through practice of the invention.

In one aspect, the present subject matter is directed to a system formonitoring seed placement within the ground during the performance of aplanting operation. The system may include a row unit configured todeposit seeds within soil, the row unit including a furrow openingassembly configured to create a furrow in the soil for depositing seedsand a furrow closing assembly configured to close the furrow after theseeds have been deposited therein. The seeds are coated seeds that arecoated with a coating having a coating dielectric property that isgreater than a dielectric property of the seeds without the coating. Thesystem may further include a seed placement sensor supported relative tothe row unit and being configured to generate data indicative of thecoated seeds as planted underneath a surface of the soil. Additionally,the system may include a computing system communicatively coupled to theseed placement sensor. The computing system is configured to receive thedata generated by the seed placement sensor, and determine a seedplacement parameter associated with the coated seeds underneath thesurface of the soil based at least in part on the data generated by theseed placement sensor.

In another aspect, the present subject matter is directed to a methodfor monitoring seed placement within the ground during the performanceof a planting operation by a row unit configured to deposit seeds withinsoil, where the row unit includes a furrow opening assembly configuredto create a furrow in the soil for depositing seeds and a furrow closingassembly configured to close the furrow after the seeds have beendeposited therein. The method may include receiving, with a computingdevice, data generated by a seed placement sensor supported relative tothe row unit, the data being indicative of the seeds as plantedunderneath a surface of the soil, where the seeds are coated seeds thatare coated with a coating having a coating dielectric property that isgreater than a dielectric property of the seeds without the coating. Themethod may further include determining, with the computing device, aseed placement parameter associated with the coated seeds underneath thesurface of the soil based at least in part on the data generated by theseed placement sensor. Additionally, the method may include performing,with the computing device, a control action associated with the row unitbased at least in part on the seed placement parameter.

In a further aspect, the present subject matter is directed to a systemfor monitoring seed placement within the ground during the performanceof a planting operation with a planting implement. The system includes arow unit of the planting implement configured to deposit seeds withinsoil. The row unit has a furrow opening assembly configured to create afurrow in the soil for depositing the seeds and a furrow closingassembly configured to close the furrow after the seeds have beendeposited therein. Each seed is treated with a treatment applied afterthe seed is received within a component of the planting implement andbefore the furrow is closed, where the treatment has a treatmentdielectric property that is greater than a dielectric property of theseeds without the treatment. The system further includes a seedplacement sensor is supported relative to the row unit and is configuredto detect the seeds as treated and planted underneath a surface of thesoil. Additionally, the system includes a computing systemcommunicatively coupled to the seed placement sensor. The computingsystem is configured to receive data generated by the seed placementsensor, and to determine a seed placement parameter associated with theseeds as treated and planted underneath the surface of the soil based atleast in part on the data generated by the seed placement sensor.

In an additional aspect, the present subject matter is directed to amethod for monitoring seed placement within the ground during theperformance of a planting operation by a row unit of a plantingimplement, where the row unit is configured to deposit seeds withinsoil. The row unit includes a furrow opening assembly configured tocreate a furrow in the soil for depositing seeds and a furrow closingassembly configured to close the furrow after the seeds have beendeposited therein. The method includes treating each seed with atreatment after the seed is received within a component of the plantingimplement and before the furrow is closed around the seed. The treatmenthas a treatment dielectric property that is greater than a dielectricproperty of the seeds without the treatment. The method further includesreceiving, with a computing device, data generated by a seed placementsensor supported relative to the row unit, the data being indicative ofthe seeds as treated and planted underneath a surface of the soil.Additionally, the method includes determining, with the computingdevice, a seed placement parameter associated with the seeds as treatedand planted underneath the surface of the soil based at least in part onthe data generated by the seed placement sensor.

These and other features, aspects and advantages of the presentinvention will become better understood with reference to the followingdescription and appended claims. The accompanying drawings, which areincorporated in and constitute a part of this specification, illustrateembodiments of the invention and, together with the description, serveto explain the principles of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

A full and enabling disclosure of the present invention, including thebest mode thereof, directed to one of ordinary skill in the art, is setforth in the specification, which makes reference to the appendedfigures, in which:

FIG. 1 illustrates a perspective view of one embodiment of a plantingimplement in accordance with aspects of the present subject matter;

FIG. 2 illustrates a side view of one embodiment of a row unit suitablefor use with a planting implement in accordance with aspects of thepresent subject matter;

FIG. 3 illustrates a schematic view of one embodiment of a system formonitoring seed placement within the ground during the performance of aplanting operation in accordance with aspects of the present subjectmatter;

FIG. 4 illustrates a flow diagram of one embodiment of a method formonitoring seed placement within the ground during the performance of aplanting operation in accordance with aspects of the present subjectmatter; and

FIG. 5 illustrates a flow diagram of another embodiment of a method formonitoring seed placement within the ground during the performance of aplanting operation in accordance with aspects of the present subjectmatter.

Repeat use of reference characters in the present specification anddrawings is intended to represent the same or analogous features orelements of the present technology.

DETAILED DESCRIPTION OF THE INVENTION

Reference now will be made in detail to embodiments of the invention,one or more examples of which are illustrated in the drawings. Eachexample is provided by way of explanation of the invention, notlimitation of the invention. In fact, it will be apparent to thoseskilled in the art that various modifications and variations can be madein the present invention without departing from the scope or spirit ofthe invention. For instance, features illustrated or described as partof one embodiment can be used with another embodiment to yield a stillfurther embodiment. Thus, it is intended that the present inventioncovers such modifications and variations as come within the scope of theappended claims and their equivalents.

In general, the present subject matter is directed to systems andmethods for monitoring seed placement within the ground during theperformance of a planting operation. Specifically, in severalembodiments, a planting implement may include a plurality of row units,with each row unit including various ground engaging tools for creatinga furrow within the soil, placing a seed within the furrow, and closingthe furrow around the seed. Additionally, one or more of the row unitsmay also include or be associated with a seed placement sensorconfigured to detect seeds within the ground. For instance, the seedplacement sensor may correspond to a non-contact sensor configured todetect seeds located underneath the soil (e.g., post-closing of thefurrow), such as a ground-penetrating radar.

In accordance with aspects of the present subject matter, the seedsplanted using the planting implement are either treated by the plantingimplement with a treatment before the furrow is closed or are coatedseeds (e.g., seeds coated with a coating before being loaded into theplanting implement), where a dielectric property (i.e., a permittivityand/or conductivity) of the treatment/coating is greater than thedielectric property of the seeds without the treatment or coating.Particularly, when ground has a higher moisture and/or clay contents,the ground causes higher attenuation of the seed placement sensor waves,which means that a seed placement sensor cannot penetrate the ground asdeeply. As such, by applying a treatment and/or coating with an improveddielectric property, particularly a higher permittivity and/orconductivity, the seed placement sensor is better able to detect thetreated or coated seeds, even when the ground has a higher moistureand/or clay content. The data generated by the seed placement sensor maythen be communicated to a computing system configured to determineand/or monitor one or more seed-related placement parameters based onthe sensor data, such as the seed depth, seed position within a trench,and/or the like, as well as one or more other seed placement parameters,such as relative seed spacing, seed population, and/or the like.

Referring now to drawings, FIG. 1 illustrates a perspective view of oneembodiment of a planting implement (e.g., a planter 10) in accordancewith aspects of the present subject matter. As shown in FIG. 1 , theplanter 10 may include a laterally extending toolbar or frame assembly12 connected at its middle to a forwardly extending tow bar 14 to allowthe planter 10 to be towed by a work vehicle (not shown), such as anagricultural tractor, in a direction of travel (e.g., as indicated byarrow 16). The frame assembly 12 may generally be configured to supporta plurality of seed planting units (or row units) 18. As is generallyunderstood, each row unit 18 may be configured to deposit seeds at adesired depth beneath the soil surface and at a desired seed spacing asthe planter 10 is being towed by the work vehicle, thereby establishingrows of planted seeds. In some embodiments, the bulk of the seeds to beplanted may be stored in one or more hoppers or seed tanks 20. Thus, asseeds are planted by the row units 18, a pneumatic distribution systemmay distribute additional seeds from the seed tanks 20 to the individualrow units 18 via one or more delivery lines 21. Additionally, one ormore fluid tanks 22 may store agricultural fluids, such as insecticides,herbicides, fungicides, fertilizers, and/or the like.

It should be appreciated that, for purposes of illustration, only aportion of the row units 18 of the planter 10 have been shown in FIG. 1. In general, the planter 10 may include any number of row units 18,such as 6, 8, 12, 16, 24, 32, or 36 row units. In addition, it should beappreciated that the lateral spacing between row units 18 may beselected based on the type of crop being planted. For example, the rowunits 18 may be spaced approximately 30 inches from one another forplanting corn, and approximately 15 inches from one another for plantingsoybeans.

It should also be appreciated that the configuration of the planter 10described above and shown in FIG. 1 is provided only to place thepresent subject matter in an exemplary field of use. Thus, it should beappreciated that the present subject matter may be readily adaptable toany manner of planter configuration or any other planting implementconfiguration, including seeders.

Referring now to FIG. 2 , a side view of one embodiment of a row unit 18is illustrated in accordance with aspects of the present subject matter.As shown, the row unit 18 includes a linkage assembly 24 configured tomount the row unit 18 to the toolbar or frame assembly 12 of the planter10. As shown in FIG. 2 , the row unit 18 also includes a furrow openingassembly 26, a furrow closing assembly 28, and a press wheel 30. Ingeneral, the furrow opening assembly 26 may include a gauge wheel (notshown) operatively connected to a frame 34 of the row unit 18 via asupport arm 36. Additionally, the opening assembly 26 may also includeone or more opening disks 38 configured to excavate a trench or furrow39 in the soil, and a firming point 32. The gauge wheel is not shown tobetter illustrate the opening disk 38. As is generally understood, thegauge wheel may be configured to engage the surface of the field, withthe height of the opening disk(s) 38 being adjusted with respect to theposition of the gauge wheel to set the desired depth of the furrow 39being excavated. Moreover, as shown, the furrow closing assembly 28 mayinclude a closing disk(s) 40 configured to close the furrow 39 afterseeds 41 have been deposited therein. The press wheel 30 may then beconfigured to roll over the closed furrow 39 to firm the soil over theseed 41 and promote favorable seed-to-soil contact.

Additionally, as shown in FIG. 2 , the row unit 18 may include one ormore seed hoppers 42, 44 and a fluid tank 46 supported on the frame 34.In general, the seed hopper(s) 42, 44 may be configured to store seeds41 received from the seed tanks 20, which are to be deposited within thefurrow 39 as the row unit 18 moves over and across the field. Forinstance, in several embodiments, the row unit 18 may include a firstseed hopper 42 configured to store seeds of a first seed type and asecond hopper 44 configured to store seeds of a second seed type.However, both seed hoppers 42, 44 may be configured to store the sametype of seeds. Furthermore, the fluid tank 46 may be configured to storefluid received from the fluid tank 22 (FIG. 1 ), which is to be sprayedonto the seeds dispensed from the seed hoppers 42, 44 or while the seedsare held within the seed hoppers 42, 44.

Moreover, the row unit 18 may include a seed meter 50 provided inoperative association with the seed hopper(s) 42, 44. In general, theseed meter 50 may be configured to uniformly release seeds 41 receivedfrom the seed hopper(s) 42, 44 for deposit within the furrow 39. Forinstance, in one embodiment, the seed meter 50 may be coupled to asuitable vacuum source (e.g., a blower powered by a motor and associatedtubing or hoses) configured to generate a vacuum or negative pressurethat attaches the seeds to a rotating seed disk of the seed meter 50,which controls the rate at which the seeds 41 are output from the seedmeter 50 to an associated seed tube 52. As shown in FIG. 2 , the seedtube 52 may extend vertically from the seed meter 50 toward the groundto facilitate delivery of the seeds 41 output from the seed meter 50 tothe furrow 39.

Referring still to FIG. 2 , one or more seed placement sensors 80 mayalso be supported relative to each row unit 18. In general, the seedplacement sensor(s) 80 may be configured to generate data indicative ofthe placement of the deposited seeds 41 within the soil, therebyallowing one or more related placement parameters to be determined forthe associated planting operation (e.g., individual seed depth/position,relative seed spacing, seed population, missing seeds, etc.). In severalembodiments, the seed placement sensor(s) 80 may be configured to detectseeds 41 located underneath the soil surface (e.g., post-closing of thefurrow 39). In such embodiments, the seed placement sensor(s) 80 maygenerally be configured to be installed on or otherwise positionedrelative to the row unit 18 such that the sensor(s) 80 has a field ofview or detection zone 82 directed towards the soil surface at alocation aft of the furrow closing assembly 28 (e.g., relative to thedirection of travel 16 of the planter 10). For instance, as shown inFIG. 2 , the seed placement sensor(s) 80 is supported relative to therow unit 18 (e.g., via a support arm 84 coupled to an associated supportarm 31 of the press wheel 30) such that the sensor(s) 80 is configuredto generate data associated with a portion of the field locatedimmediately behind the aft-most ground-engaging tool of the row unit 18(e.g., the press wheel 30). However, in other embodiments, the detectionzone 82 of the sensor(s) 80 may be directed at any other suitablelocation that allows the sensor(s) 80 to detect seeds 41 positionedunderneath the soil surface, such as at a location between the furrowclosing assembly 28 and the press wheel 30.

In several embodiments, the seed placement sensor(s) 80 may correspondto a non-contact sensor configured to detect seeds 41 located underneaththe soil surface. For instance, in one embodiment, the seed placementsensor(s) 80 may be a ground penetrating radar configured to detectseeds deposited underneath the soil surface. In such an embodiment, theseed placement sensor(s) 80 may, for example, include one or more pairsof transmitters and receivers, with the transmitter(s) being configuredto transmit electromagnetic waves towards and through the soil and thereceiver(s) being configured to detect the waves as reflected offsub-surface features (e.g., seeds). In other embodiments, the seedplacement sensor(s) 80 may correspond to any other suitable non-contactsensor capable of detecting seeds deposited underneath the soil surface.

The waves generated by the seed placement sensor(s) 80 are reflected offthe seeds due to the contrast between a dielectric property (e.g., thepermittivity and/or conductivity) of the ground and a dielectricproperty of the seeds. Ground that is moist and/or has a high claycontent generally has a higher permittivity and a higher conductivitythan ground that is dry and/or sandy, and generally has a higherpermittivity and a higher conductivity than seeds. While increaseddielectric contrast between the ground and the seeds should showimproved detectability of the seeds in moist and/or clay ground overdrier and/or sandy ground, it is generally more difficult to identifywhere the seeds are located in moist and/or clay ground as the higherpermittivity and the higher conductivity of the ground cause moreattenuation of the waves generated by the seed placement sensor(s) 80.Higher attenuation means that the waves cannot penetrate as deeply fordetecting the seeds. Thus, in accordance with aspects of the presentsubject matter, the seeds 41 dispensed by the row unit 18 may be coatedwith a coating (e.g., by a seed producer, by an operator of the plantingimplement 10, etc.) before being received by the planting implement 10and/or may be treated with a treatment (e.g., by the planting implement10) after being received by the planting implement 10 and before thefurrow 39 is closed over the seeds 41 such that the coated and/ortreated seeds have a dielectric property (e.g., the permittivity and/orconductivity) that is different than the seeds without the coatingand/or treatment. By changing the effective dielectric property of theseeds 41, the interaction between the waves and the seeds 41 changes ina way that allows the seeds 41 may be more visible to the seed placementsensor(s) 80. It should be appreciated that a given coating or treatmentmay be used that only varies one of the effective dielectric propertiesof the seeds (e.g., permittivity or conductivity) or the coating ortreatment may change both of such properties. However, when the coatingor treatment varies both properties, the magnitude of the change willgenerally vary between permittivity and conductivity as such parametersare not directly correlated.

For instance, in several embodiments, the coating and/or the treatmenthas a permittivity that is greater than a permittivity of the seedswithout the coating and/or the treatment. In one embodiment, thepermittivity of the coating and/or the treatment is greater than thepermittivity of the seeds without the coating and/or the treatment by asubstantial percentage, such as at least 25% greater than thepermittivity of the seeds without the treatment and/or coating, such as50% greater than the permittivity of the seeds without the treatmentand/or coating, such as 100% greater than the permittivity of the seedswithout the treatment and/or coating, such as 200% greater than thepermittivity of the seeds without the treatment and/or coating, such as300% greater than the permittivity of the seeds without the treatmentand/or coating, and/or the like. Similarly, in several embodiments, thecoating and/or the treatment may have a conductivity that is greaterthan a conductivity of the seeds without the coating and/or thetreatment. In one embodiment, the conductivity of the coating and/or thetreatment is greater than the conductivity of the seeds without thecoating and/or the treatment by a substantial percentage, such as atleast 25% greater than the conductivity of the seeds without thetreatment and/or coating, such as 50% greater than the conductivity ofthe seeds without the treatment and/or coating, such as 100% greaterthan the conductivity of the seeds without the treatment and/or coating,such as 200% greater than the conductivity of the seeds without thetreatment and/or coating, such as 300% greater than the conductivity ofthe seeds without the treatment and/or coating, and/or the like. Thecoating and/or the treatment may comprise any suitable coating materialand/or treatment material such that the dielectric property of the seeds41 is improved for detection by the seed placement sensor(s) 80. Forinstance, the coating material and/or treatment material may comprisegraphite, iron oxide (e.g., magnetite), and/or the like. For example, aseed without coating and treatment may have a dielectric permittivity of3-5, while graphite has a dielectric permittivity of 18 and magnetitehas a dielectric permittivity between 33-81. Similarly, a seed withoutcoating and treatment may have an electrical conductivity ofapproximately 0 Siemens/centimeter [S/cm], while graphite has anelectrical conductivity of approximately 10000 S/cm and magnetite has anelectrical conductivity of approximately 100 S/cm.

In one embodiment, the treatment may be applied to the seeds 41 by theplanting implement 10 at one or more of the seed tanks 20, the deliveryline(s) 21, or the row units 18. For instance, the treatment may beadded to the seed tanks 20 at the same time the seeds 41 are beingadded, before the seeds 41 are added, after the seeds 41 are added,and/or in any other suitable order. The treatment may be added to theseed tanks 20 via the port of the seed tanks 20 by a dispenser separatefrom the planting implement 10 and/or via a treatment dispenser 70 (FIG.1 ) mounted to the tanks 20 and controllable by the planting implement10. Alternatively, or additionally, the treatment may be introduced atthe delivery lines 21 between the seed tanks 20 and the row units 18 bya treatment dispenser 71 (FIG. 1 ) coupled to the delivery lines 21 andcontrollable to meter the treatment into the delivery lines 21 duringthe seed delivery to the row units 18. Moreover, in some embodiments,the row units 18 may include a treatment sprayer 72 supported thereonand configured to spray or otherwise dispense the treatment onto theseeds 41 dispensed from the row units 18 as the seeds 41 are dispensedfrom the row units 18 or after the seeds 41 are deposited in the furrow39. For example, as shown in FIG. 2 , the treatment sprayer 72 may bemounted on the row unit 18 such that the treatment sprayer 72 ispositioned to spray the treatment between the opening disk 38 and theclosing disk 40 to reach the seeds 41. However, the treatment sprayer 72may be configured to spray the treatment onto the seeds 41 while theseeds 41 are still in the seed tube 52 or before the seeds 41 reach theseed tube 52. In one embodiment, the treatment sprayer 72 may be fluidlycoupled to one of the fluid tanks 22, 46, and the treatment may be addedto the fluid tank(s) 22, 46. However, in another embodiment, thetreatment sprayer 72 may have a tank separate of the fluid tanks 22, 46and configured to hold the treatment. The treatment applicators 70, 71,72 may comprise any suitable elements to provide the treatment at thevarious associated locations on the planting implement 10, such as apump, a conduit, a treatment reservoir(s), a valve and/or the like.

Additionally, in several embodiments, the row unit 18 may also includeone or more sensors 90, 92 for generating data indicative of the timingand/or frequency of seeds 41 being deposited into the furrow 39 betweenthe opening and closing assemblies 26, 28. For instance, as shown in theillustrated embodiment, the row unit 18 may include one or more seedtube sensors 90 configured to detect seeds as they fall or otherwisetravel through the seed tube 52. In such an embodiment, the seed tubesensor 90 may generally correspond to any suitable sensor or sensingdevice configured to detect seeds passing through the seed tube 52(e.g., whether falling through the tube 52 via gravity or by beingconveyed through the tube 52 via a driven belt or other seed-transportmeans extending within the seed tube 52). For example, the seed tubesensor 90 may correspond to an optical sensor (e.g., a break-beam sensoror a reflectance sensor), a microwave sensor, a Hall-effect sensor,and/or the like.

In addition to the seed tube sensor 90 (or as an alternative thereto),the row unit 18 may include other sensors for generating data indicativeof the timing and frequency of seeds 41 being deposited into the furrow39. For instance, as shown in the illustrated embodiment, the row unit18 may include one or more seed meter sensors 92 configured to detectseeds 41 that are being or will be discharged from the seed meter 50.Specifically, in one embodiment, the seed meter sensor(s) 92 maycorrespond to a post-singulation sensor positioned within the seed meter50 such that the sensor's detection zone is aligned with a locationwithin a post-singulation region of the seed meter 50: (1) across whichthe seed disc or other seed transport member is rotated following thesingulator (not shown) of the seed meter 50; and/or (2) through whicheach seed 41 to be discharged from seed meter 50 passes followingrelease of the seed 41 from the seed disc. In such an embodiment, theseed meter sensor 92 may generally correspond to any suitable sensor orsensing device configured to detect seeds that are being or will bedischarged from the seed meter 50. For example, the seed meter sensor 92may correspond to an optical sensor (e.g., a break-beam sensor or areflectance sensor), a microwave sensor, a Hall-effect sensor, and/orthe like.

It should be appreciated that the configuration of the row unit 18described above and shown in FIG. 2 is provided only to place thepresent subject matter in an exemplary field of use. Thus, it should beappreciated that the present subject matter may be readily adaptable toany manner of seed planting unit configuration.

Referring now to FIG. 3 , a schematic view of one embodiment of a system100 for monitoring seed placement within the ground during theperformance of a planting operation is illustrated in accordance withaspects of the present subject matter. In general, the system 100 willbe described herein with reference to the planting implement 10, the rowunit 18, and related components described above with reference to FIGS.1 and 2 . However, it should be appreciated that the disclosed system100 may generally be utilized with any planter or seeder having anysuitable implement configuration and/or with row units having anysuitable row unit configuration.

In several embodiments, the system 100 may include a computing system102 and various other components configured to be communicativelycoupled to and/or controlled by the computing system 102, such as thetreatment applicator(s) 70, 71, 72, a meter drive member 130 configuredto rotationally drive the seed meter 50, a vacuum source 132 configuredto apply a vacuum or negative pressure to the seed disk or seedtransport member of the seed meter 50, a gauge wheel actuator 134configured to actuate gauge wheel of the row unit 18 to adjust thecurrent planting depth, and/or various sensors configured to monitor oneor more operating parameters associated with each row unit 18. Forexample, the computing system 102 may be communicatively coupled to oneor more seed placement sensors 80 (e.g., one sensor per row unit)configured to generate data indicative of the placement of the depositedseeds within the soil, such as one or more ground penetrating radarsconfigured to detect seeds located underneath the soil surface. Inaddition, the computing system 102 may be communicatively coupled to oneor more additional sensors configured to generate data indicative of thefrequency of the seeds being deposited within the furrow by each rowunit, such as a seed tube sensor 90 and/or a seed meter sensor 92provided in association with each row unit 18.

It should be appreciated that the computing system 102 may correspond toany suitable processor-based device(s), such as a computing device orany combination of computing devices. Thus, as shown in FIG. 3 , thecomputing system 102 may generally include one or more processor(s) 104and associated memory devices 106 configured to perform a variety ofcomputer-implemented functions (e.g., performing the methods, steps,algorithms, calculations and the like disclosed herein). As used herein,the term “processor” refers not only to integrated circuits referred toin the art as being included in a computer, but also refers to acontroller, a microcontroller, a microcomputer, a programmable logiccontroller (PLC), an application specific integrated circuit, and otherprogrammable circuits. Additionally, the memory 106 may generallycomprise memory element(s) including, but not limited to, computerreadable medium (e.g., random access memory (RAM)), computer readablenon-volatile medium (e.g., a flash memory), a floppy disk, a compactdisc-read only memory (CD-ROM), a magneto-optical disk (MOD), a digitalversatile disc (DVD) and/or other suitable memory elements. Such memory106 may generally be configured to store information accessible to theprocessor(s) 104, including data 108 that can be retrieved, manipulated,created and/or stored by the processor(s) 104 and instructions 110 thatcan be executed by the processor(s) 104.

In several embodiments, the data 108 may be stored in one or moredatabases. For example, the memory 106 may include a sensor database 112for storing sensor data and/or other relevant data that may be used bythe computing system 102 in accordance with aspects of the presentsubject matter. For instance, during operation of the plantingimplement, data from all or a portion of the sensors communicativelycoupled to the computing system 102 may be stored (e.g., temporarily)within the sensor database 112 and subsequently used to determine one ormore parameter values associated with the operation of the plantingimplement, including any or all data generated by the seed placementsensor 80.

Moreover, in several embodiments, the instructions 110 stored within thememory 106 of the computing system 102 may be executed by theprocessor(s) 104 to implement an application module 114. In general, theapplication module 114 may be configured to activate/deactivate thetreatment applicator(s) 70, 71, 72 to apply the treatment to the seeds41. For instance, the computing system 102 may be configured to activatethe treatment applicator(s) 70 to apply the dielectric treatment to theseeds within the tank(s) 20. Similarly, the computing system 102 may beconfigured to activate the treatment applicator(s) 71 to apply thedielectric treatment to the seeds 41 within the delivery lines 21,and/or the treatment applicator(s) 72 to apply the dielectric treatmentto the seeds 41 while the seeds 41 are being dispensed from the rowunits 18 or after the seeds 41 are placed in the furrow(s) 29. Thecomputing system 102 may control the treatment applicator(s) 70, 71, 72such that essentially every seed 41 is treated, or may control thetreatment applicator(s) 70, 71, 72 such that only some seeds 41 aretreated (such as after an end of row turn and/or the like).

It should be appreciated that, in some embodiments, the seeds 41 may beboth coated and treated. For example, in some instances, the seeds 41may be coated before being received by the planting implement 10, but,at least in some areas of the field, the seed placement sensor 80 maystill not able to detect the coated seeds 41 even though the effectivedielectric property(ies) of the seeds 41 is improved. For instance, thefield may be wetter and/or have a higher clay content than expected whenselecting the coating material. As such, it may be beneficial to treatthe coated seeds 41 to further improve the effective dielectricproperty(ies) of the seeds 41. In such instance, the computing system102 may control the treatment applicator(s) 70, 71, 72 such thatessentially every coated seed 41 is treated, or may control thetreatment applicator(s) 70, 71, 72 such that only some coated seeds 41are treated (such as after an end of row turn and/or the like). In someinstances, the treatment on the coated seeds 41 will further increaseone or both of the effective dielectric permittivity and the effectiveconductivity of the coated seeds 41. However, it should be appreciatedthat, in other instances, the treatment on the coated seeds 41 coulddecrease one or both of the effective dielectric permittivity and theeffective conductivity of the coated seeds 41.

Referring still to FIG. 3 , in several embodiments the instructions 110stored within the memory 106 of the computing system 102 may also beexecuted by the processor(s) 104 to implement a control module 116. Ingeneral, the control module 116 may be configured to initiate a controlaction based on the seed placement parameter(s) determined using thedata generated by the seed placement sensor(s) 80. For instance, in oneembodiment, the control module 116 may be configured to provide anotification to the operator indicating the determined seed placementparameter(s), such as the current seed depth or seed spacing. Forinstance, in one embodiment, the control module 116 may cause a visualor audible notification or indicator to be presented to the operator viaan associated user interface 118 provided within the cab of the vehicleused to tow the planting implement 10. For example, when the currentseed depth is greater than a predetermined seed depth threshold (oroutside of a predetermined seed depth range) and/or the current seedspacing is greater than a predetermined seed spacing threshold (oroutside of a predetermined seed spacing range), the control module 116may cause a visual or audible notification or indicator to be presentedto the operator via the associated user interface 118 of the parameterbeing greater than the respective threshold (or out of the respectiverange).

In other embodiments, the control module 116 may be configured toexecute an automated control action designed to adjust the operation ofthe row unit 18 or the planting implement 10. For instance, in oneembodiment, the computing system 102 may be configured to automaticallyadjust the depth of the furrow being cut into the soil (e.g., byadjusting the relative position of the gauge wheel and opening assembly26 via control of the gauge wheel actuator 134) based on placement dataassociated with the current depth at which the seeds are being planted.Similarly, in one embodiment, the computing system 102 may be configuredto automatically adjust the operation of the seed meter 50 to vary therate at which seeds are being deposited within the soil based onplacement data associated with the current seed spacing and/or seedpopulation. For instance, the computing system 102 may be configured toincrease or decrease the speed at which the seed disc of the seed meter50 is being rotated (e.g., via control of the meter drive member 130) ifit is determined that the seed spacing needs to be adjusted relative toa target seed spacing range. Similarly, the computing system 102 may beconfigured to increase or decrease the vacuum pressure applied to theseed meter 50 (e.g., via control of the vacuum source 132) if it isdetermined that the current seed population is too low or too highrelative to a target seed population range. As another example, thedetection of missing seeds may be indicative of plugging or issues withthe closing system. In such instances, the computing system may beconfigured to automatically adjust the operation of the row unit 18and/or the planting implement 10 to address issues related toplugging/closing.

Moreover, as shown in FIG. 3 , the computing system 102 may also includea communications interface 150 to provide a means for the computingsystem 102 to communicate with any of the various other systemcomponents described herein. For instance, one or more communicativelinks or interfaces (e.g., one or more data buses) may be providedbetween the communications interface 150 and the meter drive member 130,the vacuum source 132, and the gauge wheel actuator 134 to allow thecomputing system 102 to transmit control signals for controlling theoperation of such components. Similarly, one or more communicative linksor interfaces (e.g., one or more data buses) may be provided between thecommunications interface 150 and the various sensors 80, 90, 92, 140 toallow the associated sensor data to be transmitted to the computingsystem 102.

It should be appreciated that, in general, the computing system 102 mayinclude suitable computing device(s) that is configured to function asdescribed herein. In several embodiments, the computing system 102 mayform part of an active planting system configured to perform a plantingoperation, such as by including a vehicle controller of a work vehicleconfigured to tow an associated planting implement 10 and/or anassociated implement controller of the planting implement 10.

Referring now to FIG. 4 , a flow diagram of one embodiment of a method200 for monitoring seed placement within the ground during theperformance of a planting operation is illustrated in accordance withaspects of the present subject matter. In general, the method 200 willbe described herein with reference to the planting implement 10, rowunit 18, and system 100 described above with reference to FIGS. 1-3 .However, it should be appreciated by those of ordinary skill in the artthat the disclosed method 200 may generally be utilized to monitor seedplacement in associated with any planting implement having any suitableimplement configuration, any row unit having any suitable row unitconfiguration, and/or any system having any suitable systemconfiguration. In addition, although FIG. 4 depicts steps performed in aparticular order for purposes of illustration and discussion, themethods discussed herein are not limited to any particular order orarrangement. One skilled in the art, using the disclosures providedherein, will appreciate that various steps of the methods disclosedherein can be omitted, rearranged, combined, and/or adapted in variousways without deviating from the scope of the present disclosure.

As shown in FIG. 4 , at (202), the method 200 may include receiving datagenerated by a seed placement sensor supported relative to a row unit,the data being indicative of coated seeds as planted underneath asurface of the soil. As described above, the seeds may be coated with acoating having a dielectric property that is greater than a dielectricproperty of the seeds without the coating, such as a coating having apermittivity that is greater than the permittivity of the seeds withoutthe coating and/or having an electrical conductivity that is greaterthan an electrical conductivity of the seeds without the coating. Forinstance, the seeds 41 may be pre-coated with a coating before beingreceived in the seed tanks 20, where the coating has a permittivity thatis greater than a permittivity of the seeds without the coating and/or aconductivity that is greater than a conductivity of the seeds withoutthe coating. In such instance, the seed placement sensor 80 may generatedata indicative of the coated seeds 41 as planted underneath a surfaceof the soil, where the data clearly indicates the coated seeds 41underneath the surface of the soil compared to the surrounding soil.

Further, at (204), the method 200 may include determining a seedplacement parameter associated with the coated seeds underneath thesurface of the soil based at least in part on the data generated by theseed placement sensor. For example, as discussed above, the computingsystem 102 may determine the seed placement parameter (e.g., individualseed depth/position, relative seed spacing, seed population, missingseeds, etc.,) associated with the coated seeds 41 underneath the surfaceof the soil based at least in part on the data 112 generated by the seedplacement sensor 80.

Additionally, at (206), the method 200 may include performing a controlaction associated with the row unit based at least in part on the seedplacement parameter. For instance, as discussed above, the computingsystem 102 may perform a control action associated with the row unit 18based at least in part on the seed placement parameter, such ascontrolling an operation of the user interface 118, the meter drivemember 130, the vacuum source 132, and/or the gauge wheel actuator 134.

Referring now to FIG. 5 , a flow diagram of one embodiment of a method300 for monitoring seed placement within the ground during theperformance of a planting operation is illustrated in accordance withaspects of the present subject matter. In general, the method 300 willbe described herein with reference to the planting implement 10, rowunit 18, and system 100 described above with reference to FIGS. 1-3 .However, it should be appreciated by those of ordinary skill in the artthat the disclosed method 300 may generally be utilized to monitor seedplacement in associated with any planting implement having any suitableimplement configuration, any row unit having any suitable row unitconfiguration, and/or any system having any suitable systemconfiguration. In addition, although FIG. 5 depicts steps performed in aparticular order for purposes of illustration and discussion, themethods discussed herein are not limited to any particular order orarrangement. One skilled in the art, using the disclosures providedherein, will appreciate that various steps of the methods disclosedherein can be omitted, rearranged, combined, and/or adapted in variousways without deviating from the scope of the present disclosure.

As shown in FIG. 5 , at (302), the method 300 may include treating eachseed after the seed is received within a component of the plantingimplement and before the furrow is closed around the seed. As describedabove, the seeds may be treated with a treatment having a dielectricproperty that is greater than a dielectric property of the seeds withoutthe treatment, such as a treatment having a permittivity that is greaterthan the permittivity of the seeds without the treatment and/or havingan electrical conductivity that is greater than an electricalconductivity of the seeds without the treatment. For instance, the seeds41 may be treated with a treatment after being received within acomponent of the planting implement 10, but before the furrow 29 isclosed around the seeds 41, where the treatment has a permittivity thatis greater than a permittivity of the seeds without the treatment and/ora conductivity that is greater than a conductivity of the seeds withoutthe treatment. In such instance, the seed placement sensor 80 maygenerate data indicative of the treated seeds 41 as planted underneath asurface of the soil, where the data clearly indicates the treated seeds41 underneath the surface of the soil compared to the surrounding soil.

The method 300, at (304), may further include receiving data generatedby a seed placement sensor supported relative to a row unit of theplanting implement, the data being indicative of the treated seeds asplanted underneath a surface of the soil. For instance, as describedabove, the seed placement sensor 80 may generate data indicative of thetreated seeds as planted underneath a surface of the soil, where thedata clearly indicates the treated seeds underneath the surface of thesoil compared to the surrounding soil.

Additionally, at (306), the method 300 may include determining a seedplacement parameter associated with the treated seeds underneath thesurface of the soil based at least in part on the data generated by theseed placement sensor. For example, as discussed above, the computingsystem 102 may determine the seed placement parameter (e.g., individualseed depth/position, relative seed spacing, seed population, missingseeds, etc.,) associated with the treated seeds 41 underneath thesurface of the soil based at least in part on the data 112 generated bythe seed placement sensor 80.

The method 200 may also include performing a control action associatedwith the row unit based at least in part on the seed placementparameter. For instance, as discussed above, the computing system 102may perform a control action associated with the row unit 18 based atleast in part on the seed placement parameter, such as controlling anoperation of the user interface 118, the meter drive member 130, thevacuum source 132, and/or the gauge wheel actuator 134.

It is to be understood that the steps of the methods 200, 300 areperformed by the computing system 100 upon loading and executingsoftware code or instructions which are tangibly stored on a tangiblecomputer readable medium, such as on a magnetic medium, e.g., a computerhard drive, an optical medium, e.g., an optical disk, solid-statememory, e.g., flash memory, or other storage media known in the art.Thus, any of the functionality performed by the computing system 100described herein, such as the methods 200, 300, is implemented insoftware code or instructions which are tangibly stored on a tangiblecomputer readable medium. The computing system 100 loads the softwarecode or instructions via a direct interface with the computer readablemedium or via a wired and/or wireless network. Upon loading andexecuting such software code or instructions by the computing system100, the computing system 100 may perform any of the functionality ofthe computing system 100 described herein, including any steps of themethods 200, 300 described herein.

The term “software code” or “code” used herein refers to anyinstructions or set of instructions that influence the operation of acomputer or computing system. They may exist in a computer-executableform, such as machine code, which is the set of instructions and datadirectly executed by a computer's central processing unit or by acomputing system, a human-understandable form, such as source code,which may be compiled in order to be executed by a computer's centralprocessing unit or by a computing system, or an intermediate form, suchas object code, which is produced by a compiler. As used herein, theterm “software code” or “code” also includes any human-understandablecomputer instructions or set of instructions, e.g., a script, that maybe executed on the fly with the aid of an interpreter executed by acomputer's central processing unit or by a computing system.

This written description uses examples to disclose the invention,including the best mode, and also to enable any person skilled in theart to practice the invention, including making and using any devices orsystems and performing any incorporated methods. The patentable scope ofthe invention is defined by the claims, and may include other examplesthat occur to those skilled in the art. Such other examples are intendedto be within the scope of the claims if they include structural elementsthat do not differ from the literal language of the claims, or if theyinclude equivalent structural elements with insubstantial differencesfrom the literal languages of the claims.

What is claimed is:
 1. A system for monitoring seed placement within theground during the performance of a planting operation with a plantingimplement, the system comprising: a row unit of the planting implementconfigured to deposit seeds within soil, the row unit including a furrowopening assembly configured to create a furrow in the soil fordepositing the seeds and a furrow closing assembly configured to closethe furrow after the seeds have been deposited therein, wherein eachseed is treated with a treatment applied after the seed is receivedwithin a component of the planting implement and before the furrow isclosed around the seed, the treatment having a treatment dielectricproperty that is greater than a dielectric property of the seeds withoutthe treatment; a seed placement sensor supported relative to the rowunit and being configured to generate data indicative of the seeds astreated and planted underneath a surface of the soil; and a computingsystem communicatively coupled to the seed placement sensor, thecomputing system being configured to: receive the data generated by theseed placement sensor; and determine a seed placement parameterassociated with the seeds as treated and planted underneath the surfaceof the soil based at least in part on the data generated by the seedplacement sensor.
 2. The system of claim 1, further comprising atreatment applicator supported on the row unit, wherein the treatment isapplied to the seeds at the row unit by the treatment applicator afterthe seeds are deposited in the furrow.
 3. The system of claim 1, furthercomprising: a tank supported on the planting implement, the tank beingconfigured to store the seeds prior to delivery to the row unit; and atreatment applicator supported on the planting implement, wherein thetreatment is applied to the seeds by the treatment applicator while theseeds are stored within the tank.
 4. The system of claim 1, furthercomprising: a tank configured to store the seeds prior to delivery tothe row unit; a delivery line configured to direct the seeds from thetank to the row unit; and a treatment applicator supported on theplanting implement, wherein the treatment is applied to the seeds by thetreatment applicator while the seeds are within the delivery line. 5.The system of claim 1, wherein the treatment dielectric propertycomprises a treatment permittivity, the treatment permittivity beinggreater than a permittivity of the seeds without the treatment.
 6. Thesystem of claim 5, wherein the treatment permittivity is at least 25%greater than the permittivity of the seeds without the treatment.
 7. Thesystem of claim 1, wherein the treatment dielectric property comprises atreatment conductivity, the treatment conductivity being greater than aconductivity of the seeds without the treatment.
 8. The system of claim1, wherein the seed placement sensor comprises a ground-penetratingradar.
 9. The system of claim 1, wherein the seed placement parametercomprises at least one of a seed depth of each of the seeds or a spacingbetween the seeds.
 10. The system of claim 1, wherein the treatmentcomprises at least one of magnetite or graphite.
 11. A method formonitoring seed placement within the ground during the performance of aplanting operation by a row unit of a planting implement, the row unitbeing configured to deposit seeds within soil, the row unit including afurrow opening assembly configured to create a furrow in the soil fordepositing seeds and a furrow closing assembly configured to close thefurrow after the seeds have been deposited therein, the methodcomprising: treating each seed with a treatment after the seed isreceived within a component of the planting implement and before thefurrow is closed around the seed, the treatment having a treatmentdielectric property that is greater than a dielectric property of theseeds without the treatment; receiving, with a computing device, datagenerated by a seed placement sensor supported relative to the row unit,the data being indicative of the seeds as treated and planted underneatha surface of the soil; and determining, with the computing device, aseed placement parameter associated with the seeds as treated andplanted underneath the surface of the soil based at least in part on thedata generated by the seed placement sensor.
 12. The method of claim 11,further comprising controlling, with the computing device, a treatmentapplicator supported by the row unit to apply the treatment to the seedsafter the seeds are deposited in the furrow.
 13. The method of claim 11,wherein a tank is supported on the planting implement, the tank beingconfigured to store the seeds prior to delivery to the row unit, themethod further comprising controlling, with the computing device, atreatment applicator supported on the planting implement to apply thetreatment to the seeds while the seeds are stored within the tank. 14.The method of claim 11, wherein a tank is supported on the plantingimplement, the tank being configured to store the seeds prior todelivery to the row unit, and wherein a delivery line is configured todirect the seeds from the tank to the row unit, the method furthercomprising controlling, with the computing device, a treatmentapplicator supported on the planting implement to apply the treatment tothe seeds while the seeds are within the delivery line.
 15. The methodof claim 11, wherein the treatment dielectric property comprises atreatment permittivity, the treatment permittivity being greater than apermittivity of the seeds without the treatment.
 16. The method of claim15, wherein the treatment permittivity is at least 25% greater than thepermittivity of the seeds without the treatment.
 17. The method of claim11, wherein the treatment dielectric property comprises a treatmentconductivity, the treatment conductivity being greater than aconductivity of the seeds without the treatment.
 18. The method of claim11, wherein the seed placement sensor comprises a ground-penetratingradar.
 19. The method of claim 11, wherein the seed placement parametercomprises at least one of a seed depth of each of the seeds or a spacingbetween the seeds.
 20. The method of claim 11, further comprisingperforming, with the computing device, a control action associated withthe row unit based at least in part on the seed placement parameter.